单词solderless
网络: 无焊料的；免焊
solderless connections - wrapped connections - general requirements , test methods and practical guidance.
无焊连接。缠绕连接。一般要求试验方法和实用指南。
solderless connections - spring clamp connections - general requirements , test methods and practical guidance.
无焊连接。弹簧卡箍连接。一般要求试验方法和实用指南。
solderless connections - solderless crimped connections - general requirements , test methods and practical guidance.
无焊连接。无焊压接连接。一般要求试验方法和实用指南。
Solderless connections. Part 6 : insulation piercing connections. General requirements, test methods and practical guidance.
无焊连接.第6部分：绝缘穿孔连接.一般要求、试验方法和实施导则
Aerospace series - Elements of electrical and optical connection - Test methods - Part 425 : unwrapping, solderless wrapped connections.
航空航天系列.电气及光学连接件.试验方法.第425部分：无钎焊缠绕连接的退绕能力
Solderless connections - Part 7 : spring clamp connections - General requirements, test methods and practical guidance.
无焊连接.第7部分：弹簧夹件连接.一般要求、试验方法和实用指南
Solderless connections. Part 1 : wrapped connections. General requirements, test methods and practical guidance.
无钎焊连接件.第1部分：裹式连接件.一般要求、试验方法和实施规范
which is an Arduino clone that can easily plug into a solderless breadboard.
这是一个伊诺克隆，可以很容易堵塞成为一个焊breadboard。
Aerospace series. Elements of electrical and optical connection. Test methods. Part 319 : gastightness of solderless wrapped connections.
航空航天系列.电气及光学连接的件.试验方法.第319部分：非焊包裹连接的气体致密度
solderless connections . part 2 : solderless crimped connections . general requirements , test methods and pratical guidance.
无焊连接件。第2部分：无焊压接连接件。一般要求试验方法和操作规程指南。